Lucknow Press
Tata Electronics: The country’s leading company Tata, which is expanding its presence in the semiconductor sector, has made another big deal. Tata Electronics has signed a deal with Singapore’s company ASMPT for its chip packaging unit. Tata Electronics has signed an agreement with ASMPT Singapore to set up the infrastructure of semiconductor assembly equipment for its chip packaging units in Assam and Karnataka.
ASMPT will collaborate with Tata Electronics to promote workforce training, advanced service engineering infrastructure, automation, spares support and R&D initiatives in the areas of wirebond, flip chip, advanced packaging and integrated system packaging. Taking a significant step towards accelerating its readiness for its semiconductor assembly and test facilities at Vemagal (Karnataka) and Jagiroad (Assam), Tata Electronics has signed a Memorandum of Understanding (MoU) with ASMPT Singapore for semiconductor assembly equipment infrastructure and solutions, Tata Electronics said in a statement on Tuesday.
Tata Electronics is setting up a chip assembly plant in Assam with an investment of Rs 27,000 crore, which is expected to start next year. Apart from this, it has also set up a small chip assembly unit in Karnataka. Randhir Thakur, Managing Director and Chief Executive Officer (CEO) of Tata Electronics, said, this partnership will emphasize the growth of necessary training programs and advanced research and development, as well as promote a vibrant environment within the country. Robin Ng, Group CEO of ASMPT, said, this collaboration will not only promote technology innovation, but will also develop the talent required for sustainable growth in the future.
Tata Electronics is setting up two major chip units, including a semiconductor manufacturing facility in Dholera, Gujarat and a semiconductor assembly and test (OSAT) facility in Jagiroad, Assam. The statement said, Tata Electronics will create about 50,000 direct and indirect jobs with an investment of Rs 1,18,000 crore.
